Low cost flip chip technologies : for DCA, WLSCP and PBGA assemblies

Low cost flip chip technologies : for DCA, WLSCP and PBGA assemblies

Bibliographic Details
Main Author: Lau, John H.
Format: Book
Published: New York : McGarw-Hill, Inc. , 2000
Subjects:
Microelectronic packaging
Multichip modules (Microelectronics) > Design and construction
Description
Physical Description:585p. ; 23cm.
ISBN:0071351418

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